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STS Shoulder-Tech
Shanghai STS
Engineering Services

FPGA / ASIC Solutions

Verilog · HLS · High-Speed I/O · Algorithm Acceleration

Xilinx (AMD) / Intel (Altera) / Lattice full-platform FPGA engineering — Verilog RTL, Vivado HLS, AI inference acceleration, high-speed ADC/DAC, PCIe DMA IP integration.

Signal integrity
SI / PI / EMC
Dedicated engineer
≤ 48h
1st-pass success
> 95%
Cumulative deliver
500+ projects
Engineering DNA

Core Advantages

10+ years of HW/SW co-development expertise, with a dedicated engineering pod for every project.

🛡
01

NDA-Protected Engagement

Formal NDAs are signed before every engagement — from concept scoping, schematics, and firmware to BOM selection — so customers know their proprietary product roadmaps stay fully confidential.

🚀
02

One-Stop R&D + Manufacturing

Electronic product development, MCU/MPU firmware, circuit design, PLC, in-vehicle telematics, industrial automation, post-R&D OEM and box-build assembly — all under one roof with zero hand-off friction.

👥
03

High Q/E/S, Low Cost Tenet

We consistently adhere to the tenet of "High Quality, High Efficiency, High Service, Low Cost, with Continuous Customer Satisfaction" — going all-in on every deliverable to meet and exceed customer needs.

Why choose STS

Service Highlights

  • 01

    7nm Versal / Agilex high-end FPGA production expertise

  • 02

    PCIe Gen5 DMA · 100GbE MAC/PCS

  • 03

    Vitis AI / FINN HLS CNN inference acceleration

At a glanceEngineering Services
7nm Versal / Agilex high-end FPGA production expertise
PCIe Gen5 DMA · 100GbE MAC/PCS
Vitis AI / FINN HLS CNN inference acceleration
Engineer response≤ 48h
Delivery process

Process & Delivery

End-to-end development methodology ensuring predictable and traceable milestones.

Phase 101

Requirements & Architecture

FPGA / ASIC Solutions kick-off: SOW, system block diagram, risk assessment, key component selection. BOM cost target locked with milestone schedule.

Phase 202

Detailed Design & Simulation

Schematic / FW / RTL detailed design. SI/PI/EMC/thermal pre-simulation, EVB module-level validation. > 95% first-pass success rate.

Phase 303

Prototyping & EVT/DVT/PVT

EVT functional → DVT design validation (EMC/environmental/life) → PVT pilot. Full test reports + 8D closed-loop until sign-off criteria met.

Phase 404

MP Transfer & Sustain

DFM/DFA optimization, BOM second-source roadmap, fixture / test-rack co-development. 24h MP technical response + on-site engineering support.

Track record

Case Studies Gallery

Selected production programs — the leap from PoC to millions of units.

2013 → now · 500+ projects
01
Case Study

4K@60 Video Wall Processing

Kintex UltraScale+, 4× HDMI 2.0 in → 16-wall out, < 1 frame latency.

Key Specs
KU+ · 4× HDMI · <16ms latency
02
Case Study

SDR Platform

Zynq UltraScale+ RFSoC, 2× 5GSPS ADC + 2× 10GSPS DAC, DDC/DUC hardware accel.

Key Specs
RFSoC Gen3 · 5GSPS ADC · 0~6GHz
03
Case Study

Domestic FPGA EDA Testbench

Titan PGT180H drop-in Xilinx K7 replacement, 100% RTL portable, UART/CAN/ETH verified.

Key Specs
PGT180H · 180K LUT · LVDS 1.25G

Ready to kick off your project?

FPGA / ASIC Solutions consulting, quotation, or PoC — 1:1 engineer response within 48h.