NDA-Protected Engagement
Formal NDAs are signed before every engagement — from concept scoping, schematics, and firmware to BOM selection — so customers know their proprietary product roadmaps stay fully confidential.



Hardware to software, prototype to production.
From schematic to mass production — three pillars that underpin every STS engagement.
Formal NDAs are signed before every engagement — from concept scoping, schematics, and firmware to BOM selection — so customers know their proprietary product roadmaps stay fully confidential.
Electronic product development, MCU/MPU firmware, circuit design, PLC, in-vehicle telematics, industrial automation, post-R&D OEM and box-build assembly — all under one roof with zero hand-off friction.
We consistently adhere to the tenet of "High Quality, High Efficiency, High Service, Low Cost, with Continuous Customer Satisfaction" — going all-in on every deliverable to meet and exceed customer needs.
Schematic / PCB / FW / FPGA / ME / Tooling / SMT / Assembly / Test — a single PM for a fully integrated turn-key experience.
Schematic · PCB Layout · High-Speed SI/PI Simulation
Complete hardware design from 2-layer cost-optimized boards to 32-layer high-speed backplanes. DDR5, PCIe 5.0, 10GbE, USB4 — SI/PI simulation, impedance control, and 3D DFM checks for first-pass success.
MCU / MPU · RTOS · BSP · Drivers · Apps
8-bit to 64-bit full-range embedded platform expertise. FreeRTOS / Zephyr / Linux — bootloader, BSP porting, peripheral drivers, protocol stacks, GUI, and OTA upgrades, turn-key.
Verilog · HLS · High-Speed I/O · Algorithm Acceleration
Xilinx (AMD) / Intel (Altera) / Lattice full-platform FPGA engineering — Verilog RTL, Vivado HLS, AI inference acceleration, high-speed ADC/DAC, PCIe DMA IP integration.
Analog Front-End · LoRa / 4G · Edge · Cloud Platform
End-to-end IoT: sensor selection, analog front-end amplification / filtering / calibration, low-power wireless SoMs, edge gateways, and private / public cloud integration. NB-IoT / LoRaWAN / Cat.1bis / 4G multi-mode.
Mech · Thermal · EMC · Reliability · Turnkey Delivery
Turn-key integration from schematic to final enclosure. Creo / SolidWorks CAD, FloTHERM thermal, ANSYS FEA, EMC pre-compliance and fix, HALT / HASS, vibration, IP rating reliability validation for production-grade products.
iOS · Android · React Native · Native Performance
Professional APP development — reject inflated pricing and deliver production-grade mobile apps at accessible budgets, so teams with limited funding can still ship full-featured products. Handled by a senior mobile team with strict QC across UI design and code architecture for smooth UX and stable operation; features are custom-built around real business pain points so the APP genuinely serves growth goals.
SME-Focused · 7×24 Support · Stable & Elastic
Professional cloud and backend solution provider focused on the needs of small, medium and micro enterprises. We deliver stable, reliable cloud architectures and elastically scalable backend systems for e-commerce, office collaboration, social networking and other scenarios; 7×24 technical support, one-on-one requirements customization, end-to-end follow-through from deployment to maintenance.
SMT · DIP · Wave · 100% AOI + X-Ray
High-speed SMT + DIP end-to-end PCBA manufacturing. Handles 01005 chips, 0.3mm-pitch BGA, QFN, PoP. Full MES traceability with strict compliance to customer QMS and regulatory requirements.
Cut · Crimp · Assemble · 100% Continuity Test
Fully automated cut-crimp equipment, AWG32 ~ AWG8 wire gauges. Full-series connectors: JST / TE / Molex / AMP. Heat-shrink, braided / corrugated tube protection, taping, insert molding. Covers internal wiring, control harnesses, and communication cables.
Mold Tooling · Injection · Paint · Plating · Print
In-house tooling shop + 10 presses 50T~650T. 20+ materials: ABS / PC / PA66 / PBT / PP / TPE. 2K injection, in-mold gate cutting, over-molding, vertical insert. UV / PU / rubber paint, Al/Ni plating, IML in-mold labeling.
Box-Build · FCT · Burn-In · Pack & Ship
Turn-key box-build integrating PCBA, harness, enclosure, and BOM accessories. ESD workbenches, cleanroom, in-line ICT/FCT, burn-in, thermal cycling, vacuum pack, labeling, and direct cross-border shipping.
Shanghai Shoulder-to-Shoulder Electronic Technology Co., Ltd. (STS) was founded in 2013, headquartered in Yangpu District, Shanghai, with R&D centers in Zhengzhou and Jinan, and a manufacturing center in Anhui — covering China end-to-end. STS undertakes all forms of electronic product R&D: circuit design, MCU firmware, PLC engineering, in-vehicle telematics and industrial control; plus post-R&D OEM turnkey orders. Every engagement is covered by formal NDAs so customers can fully entrust their IP. Serving 5 verticals — image recognition, home appliances, control systems, wireless communications and industrial automation — STS is a high-tech enterprise integrating design, R&D and production.
Drop your project brief — a dedicated engineer responds within 48 hours with proposal, quote, and milestone plan.