肩并肩科技 STS Logo
STS Shoulder-Tech
Shanghai STS
OEM Manufacturing

PCBA Manufacturing

SMT · DIP · Wave · 100% AOI + X-Ray

High-speed SMT + DIP end-to-end PCBA manufacturing. Handles 01005 chips, 0.3mm-pitch BGA, QFN, PoP. Full MES traceability with strict compliance to customer QMS and regulatory requirements.

Customer QMS & Regs
Quality Assurance
Dedicated engineer
≤ 48h
R&D + Mfg in one roof
4 R&D / Mfg Sites
Cumulative deliver
500+ projects
Manufacturing quality

Core Advantages

10+ years of HW/SW co-development expertise, with a dedicated engineering pod for every project.

🛡
01

NDA-Protected Engagement

Formal NDAs are signed before every engagement — from concept scoping, schematics, and firmware to BOM selection — so customers know their proprietary product roadmaps stay fully confidential.

🚀
02

One-Stop R&D + Manufacturing

Electronic product development, MCU/MPU firmware, circuit design, PLC, in-vehicle telematics, industrial automation, post-R&D OEM and box-build assembly — all under one roof with zero hand-off friction.

👥
03

High Q/E/S, Low Cost Tenet

We consistently adhere to the tenet of "High Quality, High Efficiency, High Service, Low Cost, with Continuous Customer Satisfaction" — going all-in on every deliverable to meet and exceed customer needs.

Why choose STS

Service Highlights

  • 01

    01005 ~ 120mm full-size placement capability

  • 02

    8-zone reflow · N₂ + vacuum soldering

  • 03

    3D SPI + AOI + X-Ray + ICT/FCT 100% coverage

At a glanceOEM Manufacturing
01005 ~ 120mm full-size placement capability
8-zone reflow · N₂ + vacuum soldering
3D SPI + AOI + X-Ray + ICT/FCT 100% coverage
Engineer response≤ 48h
Delivery process

Process & Delivery

End-to-end development methodology ensuring predictable and traceable milestones.

Phase 101

DFM Manufacturability Review

50+ manufacturability checks on PCBA Manufacturing BOM / PCB / structural drawings. DFM report issued with joint engineering optimization to avoid production re-spins.

Phase 202

Low-Volume NPI Pilot

First-article (FAI) full-param inspection + 5~50 unit pilot run. SPC analysis, key processes CPK ≥ 1.33 gate before mass production.

Phase 303

High-Volume Stable Production

Full MES traceability. IQC / IPQC / OQC 3-stage QC, 100% in-line inspection at key stations — compliant with customer QMS and regulatory requirements.

Phase 404

After-Sales & Continuous Improvement

8D / 5-Why complaint handling, annual PPAP refresh, monthly DPMO reporting. 1:1 customer engineering counterpart driving PDCA kaizen.

Track record

Case Studies Gallery

Selected production programs — the leap from PoC to millions of units.

2013 → now · 500+ projects
01
Case Study

Industrial Control PCBA

18L HDI, 0.35mm BGA, 100% X-Ray, < 20 PPM delivery.

Key Specs
Customer QMS compliant · 50k/mo · PPM<20
02
Case Study

Industrial 5G Module PCBA

10L rigid-flex, FR4 + PI, -40℃ thermal cycling storage.

Key Specs
Rigid-Flex · 01005 · 3D SPI
03
Case Study

High-Reliability Industrial PCBA

Conformal coating + potting, damp-heat / salt-fog / vibration proven.

Key Specs
Conformal coat · Epoxy potting · IP67

Ready to kick off your project?

PCBA Manufacturing consulting, quotation, or DFx review — 1:1 engineer response within 48h.