01
Case StudySmart Gateway Main Board
12-layer HDI design, NXP i.MX8 + 4G CAT.4, industrial wide-temp stable.
Key Specs
12L-HDI · 8mil trace · 4× DDR3L
Engineering Services
Circuit Design Services
Schematic · PCB Layout · High-Speed SI/PI Simulation
Complete hardware design from 2-layer cost-optimized boards to 32-layer high-speed backplanes. DDR5, PCIe 5.0, 10GbE, USB4 — SI/PI simulation, impedance control, and 3D DFM checks for first-pass success.
Signal integrity
SI / PI / EMC
Dedicated engineer
≤ 48h
1st-pass success
> 95%
Cumulative deliver
500+ projects
Engineering DNA
Core Advantages
10+ years of HW/SW co-development expertise, with a dedicated engineering pod for every project.
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01NDA-Protected Engagement
Formal NDAs are signed before every engagement — from concept scoping, schematics, and firmware to BOM selection — so customers know their proprietary product roadmaps stay fully confidential.
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02One-Stop R&D + Manufacturing
Electronic product development, MCU/MPU firmware, circuit design, PLC, in-vehicle telematics, industrial automation, post-R&D OEM and box-build assembly — all under one roof with zero hand-off friction.
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03High Q/E/S, Low Cost Tenet
We consistently adhere to the tenet of "High Quality, High Efficiency, High Service, Low Cost, with Continuous Customer Satisfaction" — going all-in on every deliverable to meet and exceed customer needs.
Why choose STS
Service Highlights
- 01
Altium / Cadence Allegro / KiCad full-platform support
- 02
DDR5 / PCIe 5.0 / 10G SerDes simulation expertise
- 03
BOM cost optimization · domestic substitution roadmap
At a glanceEngineering Services
Altium / Cadence Allegro / KiCad full-platform support✓
DDR5 / PCIe 5.0 / 10G SerDes simulation expertise✓
BOM cost optimization · domestic substitution roadmap✓
Engineer response≤ 48h
Delivery process
Process & Delivery
End-to-end development methodology ensuring predictable and traceable milestones.
Phase 101
Requirements & Architecture
Circuit Design Services kick-off: SOW, system block diagram, risk assessment, key component selection. BOM cost target locked with milestone schedule.
Phase 202
Detailed Design & Simulation
Schematic / FW / RTL detailed design. SI/PI/EMC/thermal pre-simulation, EVB module-level validation. > 95% first-pass success rate.
Phase 303
Prototyping & EVT/DVT/PVT
EVT functional → DVT design validation (EMC/environmental/life) → PVT pilot. Full test reports + 8D closed-loop until sign-off criteria met.
Phase 404
MP Transfer & Sustain
DFM/DFA optimization, BOM second-source roadmap, fixture / test-rack co-development. 24h MP technical response + on-site engineering support.
Track record
Case Studies Gallery
Selected production programs — the leap from PoC to millions of units.
2013 → now · 500+ projects
02
Case StudyIndustrial 10GbE Switch Board
16-layer backplane, Broadcom switch, IEEE 1588v2 PTP sync.
Key Specs
16L · 2× 10G SFP+ · 24× GbE
03
Case StudyIndustrial Signal Acquisition Board
8ch 24-bit ADC, strict electrical isolation, leakage < 10μA.
Key Specs
8L · 24-bit ΣΔ · Isolated PSU
Ready to kick off your project?
Circuit Design Services consulting, quotation, or PoC — 1:1 engineer response within 48h.